Intel's new packaging for their latest Pentium III processors. The processor die is attached to a fiberglass PCB and surrounded with a special glue. The heat sink is affixed in such a way that it touches the die directly. The advantage: Better heat dissapation and less expensive design. The disadvantage: Much more fragile than before. One tiny mishap when applying the heat sink and you can crack the die, destroying the processor (and your day) in the process. Be careful.

Log in or registerto write something here or to contact authors.